The Higher Education Loans Board [HELB] has today started the disbursement of tuition loans to Universities and TVET Institutions.
The upkeep loans for the over 175,000 undergraduate and over 70,000 TVET continuing students under the Old Higher Education Funding Model [OFM] is currently being disbursed to students as per their respective preferred payment channels [Bank account or HELB Mobile Wallet].
Higher Learning Institutions (HLIS) – Universities and Colleges are advised to allow students to register as tuition fees to various institutions have also been released and should reflect in the respective bank accounts of the HLIs by 5th October 2023.
For the First-Time students applying for Funding under the New Higher Education Funding Model [NFM] for both Loans and Scholarships, the deadline for application is 7th October 2023 as per the extension granted by the Cabinet Secretary, Ministry of Education, Hon. Ezekiel Machogu on 5th September 2023.
The processing and disbursement of their Loans & Scholarships for both tuition and upkeep will follow shortly after the deadline date of 7th October 2023.
The Higher Education Loans Board (HELB) is a state body established by an Act of Parliament- CAP 213A in 1995 mandated to provide loans, bursaries and scholarships to Kenyans pursuing higher education in recognized Kenyan Universities and Colleges and to recover the same after completion of studies to facilitate establishment of a revolving fund.
The Board is therefore well aligned to Chapter 4, Section 43 (1) (f) of the Constitution of Kenya 2010, that every person has the right to education.
For any media queries or interview requests, contact:
Mr. Collins Wenje
Ag. Head of Corporate Communication and Customer Experience – HELB
Cell: (+254) 0725 707966
Email: [email protected]
